Efficient Performance. No Compromises.
Designed for low-power embedded applications, the Mobile Series delivers reliable performance without sacrificing efficiency. Built on the same proven architecture as the Core Series, it’s ideal for industrial, medical, and portable systems where power consumption and thermal footprint matter.
Mobile Series
Key Advantages at a Glance
- Compact Footprint – Same mechanical dimensions, connectors, and pinout across the family for effortless scalability.
- High-Density I/O – 96 HD PL IOs, 34 HP PL IOs, high-speed transceivers, and flexible clocking.
- Mid-range SoC – Dual- or quad-core Arm processor, combined with up to 256 k system logic cells and 69 Mb on-chip RAM for moderate compute needs.
- Memory & Storage – 2-4 GB DDR4, dual SPI boot flash, onboard EEPROM with MAC address.
Family Overview
The Mobile Series delivers high-density I/O in a space-saving, standardized form factor. Featuring dual- or quad-core processors paired with mid-range FPGA fabric, these modules are compact workhorses for embedded systems. Electrical and mechanical cross-compatibility within the family enables late-stage performance tuning and supports future-proof design strategies.
Common Feature Set
SoC
- AMD Zynq™ UltraScale+™ with CG, EG, or EV engine
- Dual or quad-core Arm Cortex-A53 application processor
- Dual-core Arm Cortex-R5F realtime processor
- Optional Arm Mali-400MP2 graphics processor
- Optional H.264/ H.265 video codec
- up to 256 k system logic cells
- up to 26.6 Mb total on-chip RAM
- up to 1,248 DSP slices
RAM & Storage
- 2 GB – 4 GB DDR4 SDRAM, 32bit wide
- 2x 64 MB SPI boot flash
- 2 kb EEPROM, with MAC address
- 8 GB eMMC storage
External I/O
- 96 PL HD IO
- 34 PL HP IO
- 4 PS GTR
- SDIO, JTAG
- Hi-speed USB2 ULPI transceiver
- 10/100/1000 Mbps Ethernet transceiver
Miscellaneous Features
- Programmable PLL clock generator
- Single 3.3V supply required
- On-board converters for all other voltages
Dimensions
- 50 x 40 mm (2×1.6″)
Preferred Module Variants
Optimized for research, development, and prototyping, our preferred variants are produced in high volumes and stocked in the U.S. for fast delivery through our distribution partners.
| SoC Device | Board Features |
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Custom Variants
When you move from prototyping to production, your priorities shift from immediate availability to cost‑optimized precision.
The Trenz Core family can be built to order, tailored exactly to your specifications — so you get the performance you need without paying for features you won’t use.
Available Accessories
Further customize your setup and fine‑tune performance with these options:
- Heat Spreader Kit – Improves thermal management for sustained high-load operation.
- Base boards – add crucial peripherals to further simplify and accelerate your application development.
Step 1 of 5
Application Processor
Choose your desired processor configuration for the Zynq UltraScale+ SoC. Your selection will impact system performance, power consumption, and multimedia capabilities.
Step 2 of 5
FPGA Fabric
Zynq UltraScale+ SoCs offer a range of FPGA fabric configurations to match your system’s logic, memory, and signal processing needs. Choose the model that aligns with your performance and integration goals.
System Logic Cells/ Total On-Chip RAM, DSP Slices
Step 3 of 5
Speedgrade & Temperature Range
Zynq UltraScale+ SoCs offer multiple speed grades and temperature ranges to meet performance and environmental requirements. Select the combination that best suits your deployment conditions and timing constraints.
Speedgrade
Temperature Range
Step 4 of 5
On-Board RAM
Choose the DDR4 SDRAM capacity that best suits your application’s memory requirements. RAM impacts buffering, data throughput, and multitasking capabilities.
Contact Information
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