signal traces

One Footprint. Infinite Possibilities.

Scale your product from prototype to production without costly PCB redesigns. The Premium Series delivers high‑performance AMD Zynq™ UltraScale+™ SoCs, high‑bandwidth memory, and massive I/O — all in a compact, pin‑compatible form factor.

Whether you need GPU acceleration, video processing, or raw FPGA horsepower, you can swap performance tiers late in the design cycle and keep your project on track.

Where to Buy
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TE0817-02-7AI81-A

Products / Compute Modules / 

Premium Series

Key Advantages at a Glance

  • Unified Footprint – Same size, connectors, and pinout across the family for effortless scalability.
  • High-Performance Processing – Dual or quad-core Arm Cortex-A53 with optional GPU and video codecs.
  • FPGA Muscle – Up to 750k system logic cells and 69Mb on-chip RAM for demanding workloads.
  • Memory & Storage – 2-8GB DDR4, dual SPI boot flash, onboard EEPROM with MAC address.
  • I/O Rich – Up to 204 PL IO, 65 PS MIO, high-speed transceivers, and flexible clocking.
  • From R&D to Production – In‑stock variants for rapid prototyping, custom builds for cost‑optimized volume.

Family Overview

The Premium Series shares a unified hardware footprint across a wide range of configurations — same dimensions, same connectors, same pinout — so you can scale performance without redesign. Choose from dual‑ or quad‑core processors, with or without GPU, and optional video codecs. This flexibility lets you adjust processing power late in the design cycle without delays or costly rework, reducing risk and accelerating time‑to‑market.

Common Feature Set

SoC

  • AMD Zynq™ UltraScale+™ with CG, EG, or EV engine
  • Dual or quad-core Arm Cortex-A53 application processor
  • Dual-core Arm Cortex-R5F realtime processor
  • Optional Arm Mali-400MP2 graphics processor
  • Optional H.264/ H.265 video codec
  • up to 750 k system logic cells
  • up to 69 Mb total on-chip RAM
  • up to 3,528 DSP slices

RAM & Storage

  • 2 GB – 8 GB DDR4 SDRAM, 64bit wide
  • 2x 64 MB SPI boot flash
  • 2 kb EEPROM, with MAC address

External I/O

  • up to 204 PL IO (156 HP, up to 48 HD)
  • up to 65 PS MIO
  • 4 GTR, 4 – 16 GTH
  • I2C, JTAG
  • 2 Transceiver clocks

Miscellaneous Features

  • Programmable PLL clock generator with up to 10 channels
  • Single 3.3V supply required
  • On-board converters for all other voltages
  • Separately controlled power domains for LP, FP, PL I/Os

Dimensions

  • 76 x 52 mm (3×2″)

Preferred Module Variants

Optimized for research, development, and prototyping, our preferred variants are produced in high volumes and stocked in the U.S. for fast delivery through our distribution partners.

SoC DeviceBoard FeaturesExternal I/O
  • ZU3EG device, SFVC784 package, speedgrade 1, extended temperature range
  • quad-core application processor, GPU
  • 154 k system logic cells, 9.4 Mb total RAM, 360 DSP slices
  • 4 GB DDR4 SDRAM
  • 4-channel PLL clock generator
  • 204 PL IO (156 HP, 48 HD)
  • 65 PS MIO
  • 4 PS GTR, 4 PL GTH
  • ZU7EV device, FBVB900 package, speedgrade 1, industrial temperature range
  • quad-core application processor, GPU, video codec
  • 504 k system logic cells, 44.2 Mb total RAM, 1,728 DSP slices
  • 4 GB DDR4 SDRAM
  • 10-channel PLL clock generator
  • 204 PL IO (156 HP, 48 HD)
  • 65 PS MIO
  • 4 PS GTR, 16 PL GTH
  • ZU9EG device, FFVC900 package, speedgrade 2, industrial temperature range
  • quad-core application processor, GPU
  • 600 k system logic cells, 40.9 Mb total RAM, 2,520 DSP slices, 24transceivers
  • 4 GB DDR4 SDRAM
  • 10-channel PLL clock generator
  • 204 PL IO (156 HP, 48 HD)
  • 65 PS MIO
  • 4 PS GTR, 16 PL GTH
Where to Buy

Custom Variants

When you move from prototyping to production, your priorities shift from immediate availability to cost‑optimized precision.
The Trenz Premium family can be built to order, tailored exactly to your specifications — so you get the performance you need without paying for features you won’t use.

Available Accessories

Further customize your setup and fine‑tune performance with these options:

  • Heat Spreader Kit – Improves thermal management for sustained high-load operation.
  • Starter Kit – A convenient desktop development platform with mini‑ITX enclosure, power supply, JTAG adapter, micro‑SD card, USB cable, power cord, and mounting hardware — everything you need to set up, test, and iterate in a compact workspace.

Step 1 of 5

Application Processor

Choose your desired processor configuration for the Zynq UltraScale+ SoC. Your selection will impact system performance, power consumption, and multimedia capabilities.

Step 2 of 5

FPGA Fabric

Zynq UltraScale+ SoCs offer a range of FPGA fabric configurations to match your system’s logic, memory, and signal processing needs. Choose the model that aligns with your performance and integration goals.

System Logic Cells/ Total On-Chip RAM, DSP Slices

Step 3 of 5

Speedgrade & Temperature Range

Zynq UltraScale+ SoCs offer multiple speed grades and temperature ranges to meet performance and environmental requirements. Select the combination that best suits your deployment conditions and timing constraints.

Speedgrade

Temperature Range

Step 4 of 5

On-Board RAM

Choose the DDR4 SDRAM capacity that best suits your application’s memory requirements. RAM impacts buffering, data throughput, and multitasking capabilities.

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